Verotec designs and manufactures a number of standard “electronics packaging” components and piece parts. These range from plastic guides to front panels, from subracks to enclosures and from backplanes to thermal control boards. They form a standard range of products that can be customized and assembled together to make an integrated system. This system can be a simple “low level” mechanical
assembly such as a cardframe or a complex “high level” electro-mechanical assembly such as a VME chassis. The latter may include a backplane, power supply and cooling fans.

As the manufacturer of many system building blocks, and with our in house design and engineering expertise, Verotec is ideally placed to provide our customers with solutions to system requirements. The fact that we can modify and customize parts during the manufacturing cycle gives us a competitive edge in the market, which translates into a cost
saving and reduced time to market for the customer.

Integrated systems can be “standard” by nature, adopting industry standard technologies and form factors, or they may be “custom” to suit application specific requirements. Either way, Verotec has the resources available to meet your demands.

For further information on our full range of VEROTEC Electronics Packaging products, call +44 (0)2380-246900 for personal attention.
email: sales@verotec.co.uk